1 / 4 www.asb.co.kr july 2009 p lerow tm aln1102 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass prod uction level. parameter unit specifications min typ max frequency range mhz 950 1250 gain db 25 26 gain flatness db ? 1.0 ? 1.1 noise figure db 0.65 0.70 output ip3 dbm 29.5 30.5 s11 / s22 db - 18 / - 10 output p1db dbm 16.5 17. 5 switching time (3) ? sec - supply current ma 80 100 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 55 ? c to +85 ? c. 1) oip3 is measured wit h two tones at an output power of 3 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground ou t line drawing (unit: mm) feature s s 21 = 27.0 db @ 950 mhz = 25.0 db @ 1250 mhz nf of 0.65 db ov er fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all gr ound pins for better rf and thermal performance, as shown in the dra w ing at the left side. description aln1102 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground pla ne plerow (side view) (recommended footprint) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 1100 mhz, z o.sys = 50 ohm
2 / 4 www.asb.co.kr july 2009 p lerow tm aln1102 internally matched lna module s - param e ters noise figure oip3 p1db 950~1250 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr july 2009 p lerow tm aln1102 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 950 mhz 1100 mhz 1250 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 27.00 - 20.28 - 17.04 25.98 2.02 - 20.08 - 18.01 24.98 - 18.80 - 17.10 4.75 v 27.25 - 21.31 - 17.02 26.24 2.02 - 21.27 - 18.31 25.23 - 19.74 - 17.44 5.00 v 27.49 - 22.20 - 17.05 26.46 2.03 - 22.45 - 18.55 25.46 - 20.65 - 17.74 5.25 v 2 7.65 - 22.87 - 17.04 26.63 2.03 - 23.41 - 18.67 25.62 - 21.44 - 18.01 5.50 v 27.81 - 23.33 - 17.03 26.80 2.03 24.37 - 18.76 25.78 - 22.10 - 18.17 950 mhz 1100 mhz 1250 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 30.53 17.66 0.672 29.70 16.99 0.683 29.07 16.20 0.678 4.75 v 32.15 18.60 0.668 31.42 18.17 0.683 30.81 17.42 0.687 5.00 v 33.56 19.50 0.661 32.98 19.11 0.698 32.16 18.50 0.682 5.25 v 34.69 20.09 0.669 34.13 19. 97 0.707 33.47 19.40 0.694 5.50 v 35.75 20.75 0.679 35.19 20.58 0.724 34.55 20.23 0.688 950 mhz 1100 mhz 1250 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 55 ? c 27.03 - 16.30 - 16.25 26.03 2.16 - 10.63 - 18.56 24.84 - 13.65 - 19.40 - 50 ? c 27.63 - 17.80 - 16.40 26.63 2.08 - 16.33 - 18.69 25.55 - 17.50 - 18.80 - 45 ? c 28.21 - 19.37 - 16.55 27.26 2.00 - 22.05 - 18.56 26.21 - 21.42 - 18.20 - 10 ? c 27.97 - 20.74 - 16.89 27. 01 2.01 - 22.08 - 18.47 25.96 - 20.79 - 17.90 25 ? c 27.61 - 21.61 - 17.08 26.63 2.01 - 21.92 - 18.11 25.60 - 20.58 - 17.42 60 ? c 27.43 - 21.70 - 17.10 26.45 2.03 - 21.19 - 17.74 25.40 - 19.88 - 16.71 85 ? c 27.17 - 22.09 - 17.20 26.18 2.04 - 20.84 - 17.57 25.13 - 19.41 - 16.4 2 950 mhz 1100 mhz 1250 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 55 ? c 33.37 19.27 0.362 33.03 18.97 0.378 32.17 18.25 0.432 - 50 ? c 33.27 19.26 0.365 33.02 18.96 0.396 32.22 18. 21 0.460 - 45 ? c 33.17 19.25 0.368 33.02 18.95 0.418 32.27 18.16 0.494 - 10 ? c 33.03 19.32 0.504 32.85 19.01 0.544 32.15 18.29 0.628 25 ? c 33.03 19.25 0.619 32.68 19.06 0.652 31.94 18.25 0.730 60 ? c 32.84 19.23 0.772 32.54 19.00 0.825 31.75 18.24 0.927 85 ? c 32.75 19.20 0.931 32.39 18.98 0.985 31.57 18.22 1.092 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr july 2009 p lerow tm aln1102 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be d etermined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the cust omer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln series C 13x13mm) evaluation board layout
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